Oriental Copper's copper anodes are made from high purity copper cathode with a purity of ≥ 99.90%. Our advanced technological process enables us to produce the finest copper anode that has perfect properties for copper electroplating.

Oriental Copper's copper anodes are available in:

• Phosphorous Copper Anodes (Cu-DHP)

Phosphorous-deoxidized Copper Anode (Cu-DHP)




Chemical composition	Weight percentage
Cu	99.90 %.
Phosphorous	0.015≥0.040 %

Feature

• ·  High electrical conductivity >80 % IACS
• ·  High purity copper
• ·  Smaller grain size
• ·  Very low impurity resulting in minimal sludge development
• ·  Very fine and uniform grain structure
• ·  Oil Free
• ·  Smooth and unique surface shape allows even dissolution
• ·  Consistent Phosphorous content and evenly distributed
• ·  Black film fast generated and stably adhered
• ·  Good resilience in normal and industrial atmospheres



• Oxygen Free Copper Anodes (Cu-OF)
• Electrolytic Tough Pitch Copper Anodes (Cu-ETP)

Oxygen Free Copper Anode (Cu-OF) and Electrolytic Tough Pitch (Cu-ETP)




• ·  Excellent electrical conductivity
• ·  Highest purity copper
• ·  Smaller grain size
• ·  Very low impurity resulting in minimal sludge development
• ·  Very fine and uniform grain structure
• ·  Oil Free
• ·  Smooth and unique surface shape allows even dissolution
• ·  Consistent dissolution

• Standards

  • Standards	JIS 3250	BS EN 1976	DIN 1787	ASTM B 187
    Alloy No.	C 1020	Cu-OF	OF-Cu	C10200
    Alloy No.	C 1100	Cu-ETP	E-Cu57	C11000
    Alloy No.	C 1220	Cu-DHP	SF-Cu	C12200

• Dimensions

  • Oval	80mm x 30mm or customer requirement
    Flat	Thickness >10mm Width 100-260mm or customer requirement
    Nuggets	Ø 12mm x 12mm Ø 16mm x 16mm Ø 20mm x 25mm Ø 25mm x 25mm or customer requirement
    Sphere or Ball	Ø 16mm, Ø 25mm, Ø 28mm, Ø 38mm, Ø 50mm and Ø 55mm or customer requirement

• Packaging

  • Balls & Nuggets	20 kgs/cardboard box and 1 000 kgs/pallet
    Rectangular & Oval	1 MT/wooden box, or according to customer requirement

• Use of Material

  • Phosphorous Copper (Cu-DHP)	- mainly used for the plating of Printed Circuit Boards (PCB)
    Oxygen free Copper (Cu-OF)	- for surface treatment, Lead frames and Steel
    Electrolytic Tough Pitch (Cu-ETP)	- for surface treatment, Lead frame and Steel

• Application

  • Electro Plating Applications, Antimicrobial properties Coating, Seawater Pipe-work Anti-fouling, etc.