东方铜业的阳极铜球是以99.99%最高纯度铜阴极(A级LME登录厂牌)所制造。我们的先进技术使我们得以制造出性能卓越的电解镀铜用阳极铜

东方铜业的阳极铜球產品有:

• 含磷阳极铜球 (Cu-DHP)

含磷阳极铜球含磷阳极铜球 (Cu-DHP)




Chemical composition	Weight percentage
Cu	99.90 %.
Phosphorous	0.015≥0.040 %

特性

• ·  最高纯度的铜
• ·  极低的杂质，几无渣渍产生
• ·  颗粒结构极其细致均匀
• ·  无油
• ·  光滑而独特的表面形状可使融解均匀
• ·  一致的磷含量，极佳的分布
• ·  可迅速形成黑膜且附著牢固



• 无氧阳极铜球 (Cu-OF)
• 精炼电解铜阳极铜球 (Cu-ETP)

无氧铜阳极 (Cu-OF) 及精炼电解铜 (Cu-ETP)




• ·  最高纯度的铜
• ·  极低的杂质，几无渣渍产生
• ·  颗粒结构极其细致均匀
• ·  无油
• ·  光滑而独特的表面形状可使融解均匀
• ·  均匀融解

• Standards

  • Standards	JIS 3250	BS EN 1976	DIN 1787	ASTM B 187
    Alloy No.	C 1020	Cu-OF	OF-Cu	C10200
    Alloy No.	C 1100	Cu-ETP	E-Cu57	C11000
    Alloy No.	C 1220	Cu-DHP	SF-Cu	C12200

• Dimensions

  • Oval	80mm x 30mm or customer requirement
    Flat	Thickness >10mm Width 100-260mm or customer requirement
    Nuggets	Ø 12mm x 12mm Ø 16mm x 16mm Ø 20mm x 25mm Ø 25mm x 25mm or customer requirement
    Sphere or Ball	Ø 16mm, Ø 25mm, Ø 28mm and Ø 38mm or customer requirement

• Packaging

  • Balls & Nuggets	20 kgs/cardboard box and 1 000 kgs/pallet
    Rectangular & Oval	1 MT/wooden box, or according to customer requirement

• Use of Material

  • Phosphorous Copper (Cu-DHP)	- mainly used for the plating of Printed Circuit Boards (PCB)
    Oxygen free Copper (Cu-OF)	- for surface treatment, Lead frames and Steel
    Electrolytic Tough Pitch (Cu-ETP)	- for surface treatment, Lead frame and Steel

• Application
  • Electro Plating Applications, Antimicrobial properties Coating, Seawater Pipe-work Anti-fouling, etc.